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How to Use the Charts Conductor sizing charts require knowing two of three variables: current, trace temperature rise, or trace size If you know any two of these variables, you can calculate the other When a more accurate estimate of the trace temperature rise is needed, board thickness, copper thickness, and board material are also used 16431 Chart Basics:Known Current When the current and the desired temperature rise are known, then the trace width can be calculated for various trace thicknesses A 10 C rise is a common temperature rise for a design The temperature rise should always be minimized If the designer can manage a 1 C rise or less, then the contribution to board heating will be minimized Increasing the size of a trace lowers the temperature rise, lowers the voltage drop, decreases component temperatures, and improves the reliability of the product.

The following is an example of using Fig 161: What is the required size trace that will have a 10 C rise if 6 amps is applied to it Starting with the top chart, follow the line going across from 6 amps to the curve labeled 10 C The 10 C curve represents the temperature rise that occurs for a specific size trace at that current level Next, follow the line going down from the 10 C curve and look at where it intersects the axis labeled CROSS SECTION IN SQ MILS The cross section is the cross-sectional area of the trace The final step is to determine the trace width The lower chart in Fig 161 is used to determine the trace width for various copper thicknesses For the same cross-sectional area, the width will be smaller for thick copper and wider for thin copper.

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Continuing with the example, follow the vertical line down from 200 sq mil into the lower chart to the line labeled (1 oz/ft2 ) 00014 ; see the discussion of copper thickness in Section 1645 Following the line across to the axis labeled CONDUCTOR WIDTH IN INCHES shows that the trace should be 015 in wide for a copper trace that is 00014 in thick If 3 oz copper were selected, the trace width would be approximately 005 in wide rather than 015 in wide for 1 oz copper 16432 Chart Basics:Known Cross-Sectional Area If a trace size is known, the temperature rise or the current can be determined The temperature rise can be estimated only in the range between the curves of constant temperature rise The current can be estimated if the temperature rise is given.

8 83 832 8,320 83,200 832,000 8,320,000

Each of these calculations is performed using the method presented in Fig 161..

maximum operable speed. To bring the motor to a halt, the speed is gradually decreased before stopping. Figure 6.42 illustrates the motor speed ramping.

Current vs. Cross Section for 10 C. Temp. Rise of Etched Copper Conductors 35 30 25 20 16 Current in amperes 12 9 6 4 3 2 1.5 1 .25 0 4 16 36 64 100 144 196 256 Cross section in sq. mils 324 400 484 576 676

Wetted solder joint. (Courtesy of IPC.)

on the solderability of those portions of the PCB intended to be soldered. Test coupons or PCBs are subjected to accelerated aging for a length of time defined by a coating durability requirement reflected on the procurement documentation, followed by solderability testing. Solderability is acceptable when the surfaces to be soldered have fully wetted. See Fig. 51.15 for acceptable criteria for PTHs, and Fig. 51.16 for examples of non-wetting.

29 293 2,930 29,300 293,000

Non- wetted solder joint. (Courtesy of IPC.)

51.11.1.9.2 Coating Durability Requirements. classified into three categories:

Category 1 Minimum coating durability is required. The PCB is intended to be soldered within 30 days from time of manufacture and likely to experience minimum thermal exposure. Category 2 Average coating durability is required. This classification is intended for PCBs likely to experience storage of up to 6 months from the time of manufacture and moderate thermal or solder exposure. Category 3 Maximum coating durability is required.This classification is intended for PCBs that are likely to experience long storage (over 6 months from time of manufacture) and that may experience severe thermal or solder processing steps, etc. It should be recognized that there may be significant difficulty involved, a cost premium, or delivery delay associated with PCBs specified to meet this durability level.

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