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51.11.2.3.5 Etchback. Etchback is a process for the controlled, positive removal of nonmetallic materials from side walls of holes to a specified depth. It is used to remove resin smear and then to remove the reinforcement material laterally to expose additional internal conductor surfaces. The degree of etchback is critical to function. Too much etchback creates excessively rough hole side walls and causes weak PTH structures. Etchback requirements range between 0.005 0.08 mm. The degree of etchback is measured by evaluating vertical PTH cross sections of multilayer PCBs and is determined effective if at least one of the top or bottom surfaces of the internal conductor is attached to the plated copper on both visible sides of every conductor layer. (See Fig. 51.23 for an example of acceptable etchback for all classes.) 51.11.2.3.6 Negative Etchback. This is a condition where the internal copper conductors rather than the insulating material in the hole have been laterally removed. This condition is not allowed when positive etchback is required. In all other cases, negative etchback should be minimal or nonexistent. 51.11.2.3.7 Layer-to-Layer Spacing. The minimum spacing between two consecutive layers in the PCB is determined by drawing an imaginary plane between the two most eccentric points of each of the two layers in the field of view and measuring the distance between these two planes. (See Fig. 51.24 for an example of minimum dielectric thickness between layers) 51.11.2.4 Internal Conductor Imperfections in the Microsection. In theory, circuits should be rectangular. Circuits are usually designed with this rectangular shape in mind. In practice, circuits are trapezoidal. Depending on how the circuit is formed, this shape could be close to .net qr code generator api codebude/QRCoder: A pure C# Open Source QR Code ... - GitHub
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QRCoder. qrcoder MyGet Build Status NuGet Badge. Info. QRCoder is a simple library, written in C# . NET , which enables you to create QR codes . It hasn't any ... FIGURE 51.23 Effective etchback in PTH, vertical microsection. (Courtesy of IPC.) java gs1-128, barcode generator excel, code 128 generator excel free, asp.net barcode generator, asp.net code 128 reader, winforms textbox barcode scanner qr code generator in asp.net c# ZXING.NET : QRCode Generator In ASP . NET Core 1.0 in C# for ...
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I have been using the other port ZXing. Net with some success. According to the website, it has assemblies available for the following platforms:. In designing a clean-room facility, various parameters such as energy efficiency, cleanliness, cost, temperature uniformity, humidity control, chemical exhaust efficiency, noise control and make up air supply need to be carefully considered Parameters such as temperature, humidity, ground vibration and air quality (clean-room class) have a direct effect on the manufacturing processes and the dimensional measurement Hence, it becomes imperative to have a controlled environment for any type of precision engineering activity As a part of the Precision Engineering initiatives in India, the Central Manufacturing Technology Institute (CMTI) in Bangalore established a Precision Engineering Centre with two major components, namely, a Precision Machine Shop and an underground Metrology Laboratory both with stringent environmental conditions [21] Of the various parameters, temperature has the greatest influence on the achievable level of accuracy A change in the temperature causes linear and nonlinear deformations in workpieces, machine tools and measuring devices It can also result in drifts in electronic instruments and the refractive index of air as in interferometric measurements Temperature variations could be in the form of deviations from the international reference temperature of 20 C, a change in the temperature FIGURE 51.24 Layer-to-layer spacing, minimum dielectric thickness, vertical microsection. (Courtesy of IPC.) net qr code open source Best 20 NuGet qrcode Packages - NuGet Must Haves Package
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ZXing ("Zebra Crossing") barcode scanning library for Java, Android - zxing / zxing . ... ZXing . NET , port to . NET ... QR code is trademarked by Denso Wave, inc. a rectangle or differ significantly from it. The further from a rectangle that the shape is, the less volume the circuit has to conduct current compared to a corresponding rectangular circuit. Terms like outgrowth, undercut, overhang, and etch factor are used to define the attributes of these shapes (see Fig. 51.25 and 51.6). 51.11.2.4.1 Conductor Width. This attribute is measured at the widest point of the circuit in the microsection. The procurement documentation should state the minimum allowable width. (See Fig. 51.6) 51.11.2.4.2 Conductor Thickness. Conductor thickness depends on the thickness of the base foil used and the additional plating added to the surface during any plating processes. Allowances for expected reduction of both foil and plating thicknesses due to manufacturing processes must be considered. A detailed table of these minimum acceptable conductor thicknesses with allowances for manufacturing processing can be found in IPC-A-600. Circuit geometry. (Courtesy of IPC.) R/W* 51.11.2.5 PTH Imperfections. Nothing affects the function of the PCB more than imperfections in the PTH. These imperfections are usually not observable from the surface, and microsectional sampling of holes is limited to almost statistical insignificance. Despite this, evaluations of the microsection represent one of the most important evaluations that can be done on a PCB. 51.11.2.5.1 Annular Ring. Minimum internal annular ring is evaluated on the internal copper land that exhibits the shortest distance between its outer edge and where it ends in or at the plating in the hole. It should be noted that a microsection identifies layer shift in only one direction and that microsections in both x and y directions should be evaluated to determine accurately the actual shift that may be present. Horizontal sections from the top of the PCB down to the layer in question give a 360 view of the pad and can be used to exactly identify minimum annular ring and layer shift. The procurement documentation should specify the requirement for minimum annular ring (see Fig. 51.26), and in cases where the allowable annular ring is zero or breakout, the breakout cannot be allowed in the area where the circuit enters the pad, as this will reduce the circuit s current-carrying capacity. 51.11.2.5.2 Lifted Lands. Lifted lands on the PCB surface prior to thermal stress are not allowed and if found, the entire inspection lot should be reevaluated to the externally observable visual requirements for lifted lands described earlier in this chapter. Lifted lands after thermal stress are allowed. 51.11.2.5.3 Cracks. Cracks in the foils and platings in the microsection are broken into the following six categories (see Fig. 51.27): Microelectro-mechanical Systems (MEMS) FIGURE 51.26 Internal annular ring measurement, horizontal and vertical microsection (does not include plating). (Courtesy of IPC.) how to generate qr code in asp.net using c# codebude/QRCoder: A pure C# Open Source QR Code ... - GitHub
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