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Serial EEPROMs are getting very popular for a variety of reasons. You can store up to 64 Kbytes of data in small 8-pin DIP package. The communication takes only two signals, since most serial EEPROMs are available with IIC interface. These EEPROMs can be written 100,000 times or even more. Even though the data write takes 10 ms, by writing an entire page at a time, the average write rate can be improved. Writing a page of data into the EEPROM also takes almost the same time as writing a byte. The page size can vary between 16 bytes for smaller-capacity EEPROMs to 128 bytes for the larger 64Kbyte capacity EEPROMs. Thus data transfer speeds can be improved by writing in a burst mode. Figure 6.47 (appearing later in this chapter) illustrates the circuit schematic for the AVR to EEPROM interface. A MAX232 RS-232 line translator has been connected so that the user can read and write data to the EEPROM.

5111193 Surface Finishes Tin-lead solder alloys (eg, 63/37) are the most popular alloy used for surface finishes on PCBs Other surface finishes are rapidly finding their way onto the PCBs IPC-6012 lists more than 20 different surface finishes that are now in use for PCBs Lead-free alloys are also appearing on PCBs It is important to understand that the composition and type of the surface finish influence solderability The procurement documentation must state specifications for surface finish Methods available for analyzing the alloy composition on the plated PCB include wet analysis, atomic absorption, and x-ray fluorescence (XRF) XRF is popular because of the ease of obtaining the alloy composition and thickness nondestructively 5111110 Electrical Inspection.

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The main functions of a clean room include [20] the following: Provide a filtered supply of air at a sufficient flow rate and with effective flow patterns to reach a specified class of cleanliness Provide filtered outdoor air for occupants and equipments Effectively exhaust unwanted chemicals Maintain a specified clean-room pressure Add or remove moisture to regulate the clean-room humidity Add or remove thermal energy to regulate the clean-room temperature

These inspections are performed to verify circuit integrity after processing and substantiate that the electrical continuity, signal integrity, and isolation characteristics of the PCB meet the design specifications Electrical inspection methods are typically performed on the production PCBs, but evaluation of signal integrity is routinely performed on specially designed test coupons Two popular nondestructive electrical tests are insulation resistance and circuit continuity testsThese are usually performed on 100 percent of complex PCBs, especially multilayer onesAutomated electrical test equipment with either stationary or moving test probes allows the probes to make contact with the all parts of the circuit pattern in order to verify the continuity and isolation characteristics of the PCB 51111101 Circuit Continuity Continuity tests are performed on PCBs to verify that the printed circuit pattern is interconnected as designed.

Testing can be performed with an inexpensive multimeter for simple PCBs or with more elaborate automated equipment such as a computer-enhanced bed-of-nails or flying probe tester These types of automated testers can either be preprogrammed with the circuit interconnection information derived from the computer design files or can use a known good golden PCB as a test template to learn the interconnection information The preferred method is to perform the continuity test on all PCBs submitted for acceptance This method is especially recommended for multilayer circuitry, where the internal patterns and interconnections cannot be inspected visually after fabrication 51111102 Insulation Resistance (Circuit Shorts) The purpose of this test is to measure the resistance offered by the insulation system of a PCB to an applied voltage Low insulation resistances can prevent proper operation of circuits by permitting the flow of leakage current.

This test can also reveal the presence of contaminants from processing residues The test is performed by applying voltage to isolated nets and measuring the current flow between these nets Test voltages of 40 to 500 VDC and minimum insulation resistances of 100 to 500 meg-ohm are popular As with continuity testing, insulation resistance testing typically employs automated test equipment using stationary or moving probes 51111103 Impedance Impedance (see Fig 5117) is the amount of resistance a circuit offers alternating current (AC) signals High frequency AC circuits require that the impedance of PCB circuits be matched to that of the components in order to transfer the most signal between the components on the assembly Proper impedance matching also reduces radio wave emissions (EMF) from the assembly.

Impedance is measured using Time Domain Reflectometry (TDR) and is typically measured using a specially designed test circuit on a coupon Requirements for impedance as well as test circuit design must be supplied to the PCB manufacturer Variations in impedance of up to 10 percent around the nominal value are expected and are not unusual do to standard process variations in circuit geometry and insulation make up Tighter control of impedance is possible, but special attention must be made to processes and materials to achieve reductions in variation..

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